How a board travels through the process

The whole floor is ESD-controlled, under ISO 9001-2015

1. Goods in

   1. Boards and components arrive — sourced by us, or consigned by you

   2. Check Goods-in inspection: that everything arrived, that the types and values match the BOM, the quantities, and the condition of the packaging

2. SMT, top side

   1. Solder paste printing

   2. Check Paste inspection — automatic 2D on the printer, or visual

   3. Component placement

   4. Check Visual inspection before the oven

   5. Reflow soldering — lead-free or leaded

   6. Check Visual inspection out of the oven

3. Bottom side

   1. Where the board carries SMT components on the underside as well, it takes one of two routes: (as needed)

      • Glued Adhesive through a stencil, or dispensed for a short run, then placement, then drying in the reflow oven on a drying programme. The parts are fixed in place for wave soldering along with the through-hole joints.
      • Solder paste Printed and placed as on the top side, then reflowed. The through-hole joints are soldered selectively afterwards.

4. Through-hole

   1. Through-hole components fitted by hand

   2. Soldering — wave, or selective, according to the route the board took

   3. Washing is usually not needed, the paste is no-clean; done on request (as needed)

5. Finishing the board

   1. Check Visual inspection

   2. Depanelling (as needed)

   3. Firmware loading

   4. Check Functional test of every unit, on a pogo-pin jig we machine ourselves. On request, and agreed with you: what can be tested depends on the product (as needed)

6. Assembly

   1. Conformal coating or potting (as needed)

   2. Cable assemblies (as needed)

   3. Enclosure and final assembly, including ultrasonic welding (as needed)

7. Out

   1. Check Inspection before packing

   2. Packing and despatch